• Senior Package Design Engineer

    Job Locations US-CA-Sunnyvale
    Job ID
  • Overview


    Dedicated to making data faster and safer, Rambus creates innovative hardware, software and services that drive technology advancements from the data center to the mobile edge. Our architecture licenses, IP cores, chips, software, and services span memory and interfaces, security and emerging technologies to positively impact the modern world. 


    Our customers are leading chip and system design firms, foundries, and service providers. Our products are integrated into tens of billions of devices and systems. They power and secure diverse applications in a growing number of target segments including data center, networking, AI, automotive and IOT.


    Rambus is seeking to hire exceptional talent to join some of the brightest inventors and engineers in the world to develop products that have real life impact. 


    Rambus is looking for an experienced IC package design engineer in the Systems Engineering team of IP Cores BU. The suitable candidate will be involved through the design and development phase of both high-speed complex SerDes and Memory IP PHY development as well as semiconductor product chips. You will work closely with die floor-planning and physical design teams to complete package/interposer route feasibility studies for the targeted applications considering the form-factor, cost and performance. You will be responsible for developing the die level bump-out and the package level pin-out and the overall package design, development and manufacturing. You will also be responsible for the analyzing this database and ensuring that it meets the electrical signal and power integrity requirements. You will document the design and release package design guideline.


    • Complete package/interposer design feasibility studies and provide feedback for IC and PCB design teams.
    • Recommend package layer stack-up, material, impedance targets and net assignments for signals
    • Complete package designs and parasitic extractions for Rambus products
    • Optimize single-ended/differential insertion loss, return loss, cross-talk for high speed buses
    • IR Drop and PDN optimization in packages/interposers. Recommend caps on packages
    • Complete system level PDN analysis and recommend decoupling strategies
    • Optimize and implement routing for high-speed signals and power planes
    • Document package design customer integration guides
    • Design BGA packages for high frequency ICs using Allegro Package Designer using SIP Layout
    • Model BGA packaging in 3D and perform tradeoff studies
    • Develop package designs for signals exceeding 100Ghz GHz using RF transmission lines
    • Complete package extractions (signal and power) using standard industry tools
    • Complete system level PDN analysis using Keysight ADS, HSPICE
    • Complete transient channel simulation using Keysight ADS, HSPICE


    • Strong background in Electromagnetics and Transmission Line principles
    • Experience with IC package/interposer design tools such as Cadence APD or SiP
    • Strong interpersonal, written and verbal skills to work with vendors, internal and external customers
    • Proficient in 2D/3D with modelling tools such as Cadence Sigrity, Ansoft HFSS/Q3D, Keysight ADS
    • Knowledge of high-speed IO interfaces including DDR/GDDR/LPDDR/HBM, PCIE, 28G Ethernet, 56G/112G PAM4
    • Strong understanding of package substrate manufacturing design rules and materials
    • BS and/or MS in Electrical/Computer Engineering or Physics 
    • 5+ years relevant experience in high speed package design and signal integrity
    • Strong communication skills and ability to interact with both internal and external customers to understand how to best address requirements in terms of their package requirements.
    • Technically creative, results oriented with the ability to manage multiple tasks
    • High degree of self-motivation and personal responsibility 
    • Team player with strong collaborative problem-solving skills

    Rambus offers a competitive compensation package, which includes a strong base salary, bonus, equity, matching 401(k), employee stock purchase plan, comprehensive medical and dental benefits, time-off program and gym membership.


    Rambus creates cutting-edge semiconductor and IP products, spanning memory and interfaces to security, smart sensors and lighting. Our chips, customizable IP cores, architecture licenses, tools, services, training and innovations improve the competitive advantage of our customers. We collaborate with the industry, partnering with leading ASIC and SoC designers, foundries, IP developers, EDA companies and validation labs. Our products are integrated into tens of billions of devices and systems, powering and securing diverse applications, including Big Data, Internet of Things (IoT), mobile, consumer and media platforms. At Rambus, we are makers of better. For more information about Rambus, visit rambus.com. For additional information on life at Rambus and our current openings, check out rambus.com/careers/.

    Rambus is proud to be an Equal Employment Opportunity and Affirmative Action employer. We do not discriminate based upon race, religion, color, national origin, sex (including pregnancy, childbirth, or related medical conditions), sexual orientation, gender identity, gender expression, age, status as a protected veteran, status as an individual with a disability, genetic information, or other applicable legally protected characteristics.


    Rambus is committed to providing reasonable accommodations for qualified individuals with disabilities and disabled veterans in our job application procedures. If you need assistance or an accommodation due to a disability, you may let us know in the application.




    Sorry the Share function is not working properly at this moment. Please refresh the page and try again later.
    Share on your newsfeed