Senior Package Design Engineer

US-CA-Sunnyvale
Job ID
2017-5987
Category
Engineering

Overview

At Rambus, we are turning incredible possibilities into everyday reality by helping to deliver the innovations that greatly impact the world we live in. We create leading-edge semiconductor and IP products, spanning memory and interfaces to security to smart sensors and lighting. Our products are integrated into tens of billions of devices and systems around the globe, running critical applications for Big Data, Internet of Things (IoT), mobile, and consumer and media platforms.

 

And our history runs deep – we have been a staple in Silicon Valley for the past 25 years and are continually anticipating key technology trends and are developing innovations that drive market changes. From a pure IP provider to becoming a fabless chipmaker, Rambus is evolving to address critical challenges in the semiconductor industry.

As a dynamic organization, we are always seeking to hire exceptional talent to join some of the brightest inventors and engineers in the world to explore their passions to develop products that have real life impact. As well, Rambus benefits are among the most comprehensive and competitive in Silicon Valley.

 

 

Memory and interfaces are in our DNA. Leveraging over two decades of high-speed circuit design leadership, we make high-performance, low-power memory and serial link interface chips and IP cores to meet the needs of increasingly diverse enterprise and mobile applications. Featuring proven IP and advanced technology, our product families include server DIMM chipsets, R+ DDRn PHYs and R+ Serial Link PHYs.

 

Rambus offers an extremely competitive compensation package, which includes a strong base salary, bonus, equity, matching 401(k), employee stock purchase plan, comprehensive medical and dental benefits, time-off program and gym membership.

 

 

Rambus creates cutting-edge semiconductor and IP products, spanning memory and interfaces to security, smart sensors and lighting. Our chips, customizable IP cores, architecture licenses, tools, services, training and innovations improve the competitive advantage of our customers. We collaborate with the industry, partnering with leading ASIC and SoC designers, foundries, IP developers, EDA companies and validation labs. Our products are integrated into tens of billions of devices and systems, powering and securing diverse applications, including Big Data, Internet of Things (IoT), mobile, consumer and media platforms. At Rambus, we are makers of better. For more information about Rambus, visit rambus.com. For additional information on life at Rambus and our current openings, check out rambus.com/careers/.

Responsibilities

Rambus is looking for an experienced IC package design engineer in the Systems Engineering team of the Memory and Interfaces Division. The suitable candidate will be involved through the design and development phase of both high-speed complex IP PHY development as well as semiconductor product chips targeting high-end datacenter requirements. Working closely with R&D teams, you will be responsible to conduct initial floor planning and feasibility for the targeted application taking into account form-factor, performance and cost requirements. During the development phase, you will collaborate on iterative die-level floor planning and pin assignments and resolve the detailed technical requirements related to the design, manufacturing and assembly of packages. You will also be responsible for definition and documentation of design rules and documentation to guide our customers’ products. Experience in signal and power integrity concepts and familiarity in usage of simulation tools is strongly preferred.  Responsibilities Include

  • Complete package/interposer design feasibility studies and provide feedback for IC design and PCB design teams.
  • Recommend package layer stack-up, material, impedance targets and net assignments for signals
  • Complete package designs and parasitic extractions for Rambus products and IP Phys
  • Optimize single-ended/differential insertion loss, return loss, cross-talk for signals and high speed buses
  • IR Drop and PDN optimization in packages/interposers. Recommend caps on packages
  • Optimize and implement routing for high-speed signals and power planes
  • Document design guidelines for package designs
  • Proactively work on documentation in the form of user guide and integration guide to address customer integration questions. 
  • Design BGA packages for high frequency integrated circuits using Allegro Package Designer using SIP Layout
  • Model BGA packaging in 3D and perform tradeoff studies
  • Develop package designs for signals exceeding 50 GHz using RF transmission lines
  • Work with HFSS and package engineers to fine tune package layouts

Qualifications

 

  • Strong background in Electromagnetics and Transmission Line principles
  • Experience with IC package/interposer design tools such as Cadence APD or SiP
  • Strong interpersonal, written and verbal skills to work with vendors and internal customers (design teams) and external customers
  • Proficient in 2D/3D with modelling tools such as Cadence Sigrity, Ansoft HFSS/Q3D, Keysight ADS
  • Knowledge of high speed bump compliance including DDR3/DDR4. LPDDR4, PCIE3/4, 10GKR, 28G Ethernet, 56G PAM4
  • Strong understanding of package substrate manufacturing design rules and materials
  • Bachelors and/or Master’s Degree in Electrical and/or Electronic Engineering, Computer Engineering or Physics 
  • 5+ years relevant experience in high speed package design and signal integrity
  • Strong communication skills and ability to interact with both internal and external customers to understand how to best address requirements in terms of their package requirements.
  • Technically creative, results oriented with the ability to manage multiple tasks
  • High degree of self-motivation and personal responsibility. 
  • Have the ability to work well within a team environment.

-------

Rambus offers an extremely competitive compensation package, which includes a strong base salary, bonus, equity, matching 401(k), employee stock purchase plan, comprehensive medical and dental benefits, time-off program and gym membership.

Rambus creates cutting-edge semiconductor and IP products, spanning memory and interfaces to security, smart sensors and lighting. Our chips, customizable IP cores, architecture licenses, tools, services, training and innovations improve the competitive advantage of our customers. We collaborate with the industry, partnering with leading ASIC and SoC designers, foundries, IP developers, EDA companies and validation labs. Our products are integrated into tens of billions of devices and systems, powering and securing diverse applications, including Big Data, Internet of Things (IoT), mobile, consumer and media platforms. At Rambus, we are makers of better. For more information about Rambus, visit rambus.com. For additional information on life at Rambus and our current openings, check out rambus.com/careers/.

Options

Sorry the Share function is not working properly at this moment. Please refresh the page and try again later.
Share on your newsfeed